Specification
| Parameter | HPMC (Tile Grade) | HEC (Tile Grade) | RDP (VAE Type) |
| Viscosity (2%, 20°C) | 40,000–200,000 mPa·s | 10,000–80,000 mPa·s | N/A |
| Methoxyl content (%) | 19–30 | — | — |
| Hydroxypropyl content (%) | 4–12 | — | — |
| Hydroxyethyl content (%) | — | 38–50 (MS) | — |
| Moisture content (%) | ≤5 | ≤5 | ≤2 |
| Ash content (%) | ≤5 | ≤5 | ≤10 |
| Particle size (mesh) | 80–120 | 80–120 | 400–600 μm |
| Recommended dosage (%) | 0.2–0.4 | 0.1–0.3 | 1.0–5.0 |
| Gel temperature (°C) | 58–90 | >70 | N/A |
| pH (1% solution) | 5.0–8.0 | 6.0–8.5 | 5.0–8.0 |
Note: All grades are available in customized viscosity and particle size upon request.
Application
Tile adhesive additives are used across a broad range of construction bonding and flooring installation scenarios:
- Standard wall tile adhesive (C1/C2 class) – HPMC at 0.25–0.35% dosage provides 20–30 minute open time and ≥0.5 N/mm² tensile adhesion strength per EN 12004.
- Large-format tile adhesive (>60×60 cm) – Higher-viscosity HPMC combined with RDP at 2–4% improves sag resistance and prevents tile slippage on vertical surfaces.
- Rapid-set adhesive systems – Low-dosage HEC (0.1–0.15%) is preferred in rapid-set formulations where gel temperature tolerance and quick moisture management are priorities.
- Flexible adhesive (C2TE class) – RDP at 3–5% combined with HPMC delivers the deformability (≥2.5 mm S1 class) required for underfloor heating substrates and wood-based panels.
- Exterior cladding adhesive – UV-stable HPMC grades with high hydroxypropyl content improve freeze-thaw cycle resistance for facade tile installations.
- Marble and natural stone – Low-ash, white HPMC grades prevent discoloration of translucent stone materials.

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