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How does the MP series of daily chemical grade adhesives ensure the structural durability of ceramic products?

1. The working principle of the MP series adhesives

  • Molecular structure design

The MP series adhesives adopt an organic-inorganic hybrid molecular architecture, whose main chain is composed of siloxane (Si-O-Si) and the side chain introduces flexible polymer groups. This special structure gives the material dual characteristics: the inorganic part provides high temperature resistance (can withstand sintering temperatures above 800°C); the organic part maintains elasticity and relieves the internal stress of ceramics caused by thermal expansion and contraction.

  • Nano-enhancement technology

Adding 5-20nm aluminum oxide nanoparticles as a reinforcement phase, the nanoparticles fill the gaps in the molecular chains, and the density of the bonding layer is increased by 40%. A three-dimensional network structure is formed, and the shear strength reaches 18MPa.

  • Chemical bonding mechanism

The adhesive is bonded to the ceramic matrix through three bonding methods:

Covalent bond: dehydration condensation of silanol (Si-OH) and hydroxyl groups on the ceramic surface

Hydrogen bond: secondary bond between polymer chain segments and ceramic lattices

Mechanical interlocking: adhesive penetrates into ceramic micropores to form an anchoring effect

 

2. Performance advantages

Performance indicators

MP series

Epoxy resin

Silicate

Operating temperature

800℃

180℃

600℃

Bond strength (MPa)

18

25

10

Curing shrinkage (%)

0.3

1.8

0.5

Resistance to moisture and heat aging

5

2

4

 

3. Performance of structural durability

Thermal stability

Thermogravimetric analysis (TGA) shows that the temperature of 5% weight loss reaches 420℃ in a nitrogen atmosphere

Thermal cycle test (-30℃~300℃ cycle 100 times): bonding strength retention rate>95%

Environmental tolerance

Moisture and heat resistance: 1000 hours under 85℃/85%RH environment, no delamination and cracking

Chemical resistance: After immersion in acid (pH3) and alkali (pH10) solutions for 30 days, the bonding strength decay is less than 8%

Mechanical property optimization

Fracture toughness (KIC): 2.8 MPa·m¹/², 3 times higher than traditional adhesives

Fatigue life: After 10⁶ cycles of loading, the crack growth rate is less than 10⁻⁷ mm/cycle

Zhejiang Yisheng New Material Co., Ltd.